On January 28, SK Hynix announced it will establish a tentatively named “AI Co.” in the United States, backed by a $10 billion investment, to seize opportunities in the AI era, tap new growth engines, and reinforce its core position in the global memory‑chip market.
The new AI company will be formed by restructuring SK Hynix’s California‑based subsidiary Solidigm (a NAND‑product solutions company). Solidigm will be renamed AI Co., while its existing business will be transferred to a newly created Solidigm Inc. to preserve brand continuity. AI Co. will serve as the dedicated platform for SK Hynix’s AI initiatives, with its official name to be announced later this year.
SK Hynix stated that it will leverage its core technological strength in HBM (High‑Bandwidth Memory) to provide optimized AI systems for data‑center customers, while continuing to invest in and deepen collaborations with global AI firms. By coordinating with affiliated companies within the SK Group, it aims to enhance its competitiveness and deliver diversified AI data‑center solutions. The U.S. move also aligns with local policy directions and supports its global AI deployment.
The strategic expansion is underpinned by SK Hynix’s dominant position in the HBM market. As competition for HBM4 supply intensifies this year, SK Hynix has secured over two‑thirds of NVIDIA’s HBM4 procurement orders, with industry sources indicating its share is approaching 70%, significantly above earlier market expectations.
While Counterpoint previously forecast SK Hynix’s global HBM4 market share at 54% in 2026, surging demand is now expected to lift its share to around two‑thirds. Some analysts even project its proportion of NVIDIA’s HBM4 purchases could exceed 70% this year. This achievement stems from its long‑standing partnership with NVIDIA and demonstrated capability for high‑yield mass production, where consistent quality and volume capacity have become critical competitive advantages in the current HBM market.
Notably, SK Hynix recently posted record revenue and net profit in 2025 and is accelerating capacity investments. In addition to building an HBM packaging plant in Indiana, USA, it is investing in advanced chip‑packaging facilities in South Korea, comprehensively strengthening its leadership in both AI and memory‑chip sectors.
ICgoodFind : SK Hynix’s $10 billion commitment to U.S. AI operations, built on its HBM4 dominance, reinforces its lead in the AI‑storage race and underscores its strength as an industry leader.
